Basic PCB
Reliable, cost-effective solutions for everyday electronics
Cost-effective, widely used, and production-friendly, standard PCBs are the go-to choice for a broad range of general-purpose electronic applications. Typically single-layer or double-layer designs, these boards offer a solid foundation for basic to moderately complex circuits where high-speed signals or multilayer routing are not required.
Key Features:
- Layers: 1–2 layers
- Material: Standard FR4 (130–140°C Tg available)
- Minimum Line Width/Spacing: ≥ 6 mil (0.15 mm)
- Hole Diameter: Standard mechanical drill sizes
- Surface Finish: HASL (lead or lead-free), OSP optional
- Solder Mask & Silkscreen: Available in standard colors (green, white, black)
Advantages:
- Low Cost: Ideal for high-volume production with tight budget constraints
- Quick Turnaround: Simple design enables faster prototyping and manufacturing
- Proven Stability: Robust for low-frequency, low-heat applications
- Easy Assembly: Compatible with both manual and automated assembly lines
Typical Applications:
- LED lighting boards
- Mobile phone chargers and power adapters
- Toys and consumer electronics
- Small appliances and household gadgets
- Entry-level IoT modules and controller boards
Complex Multilayer PCBs
Powerful multilayer performance for industrial and commercial demands
Multilayer PCBs with moderate-to-high complexity are the backbone of many industrial and commercial electronics. Designed to handle greater circuit density, improved signal integrity, and reliable power distribution, these boards strike an ideal balance between performance, cost, and manufacturability. Whether for industrial control systems or modern automotive modules, they offer robust performance without the cost and complexity of HDI.
Key Features:
- Layers: 4 to 10 layers
- Material: High-TG FR4, halogen-free options available
- Minimum Trace/Spacing: ≥ 4 mil (0.1 mm)
- Via Types: Through-hole, with optional blind and buried vias
- Lamination: Standard and mixed lamination processes supported
- Surface Finishes: ENIG, immersion silver, OSP, etc.
- Solder Mask: Available in various colors, including green, blue, black
Advantages:
- Increased Density: Ideal for compact designs requiring more routing layers
- Improved Signal Integrity: Better noise control and layer shielding
- Thermal Reliability: High-TG and high-temperature-resistant materials
- Design Flexibility: Supports power/ground plane separation, controlled impedance, and complex stack-ups
- Cost-Effective Scaling: Suitable for medium to high-volume production with lower cost than HDI
Typical Applications:
- Industrial control systems and automation equipment
- Network switches, routers, and communication modules
- Power supply and conversion modules
- Automotive ECUs, battery management systems (BMS)
- Smart appliances and embedded systems
Advanced / HDI PCB
From Design to Precision Manufacturing
HDI (High-Density Interconnect) PCBs represent the pinnacle of modern circuit board engineering, enabling ultra-compact, high-performance designs with exceptional electrical integrity. These boards use advanced technologies like microvias, via-in-pad, laser drilling, and stacked via structures to support high-speed signals, fine-pitch components, and multilayer interconnects. Designed for mission-critical and miniaturized applications, HDI boards are ideal for industries where space, speed, and signal quality are non-negotiable.
Key Features:
- Layers: Typically 8 or more layers
- Via Types: Microvias, stacked vias, blind/buried vias, via-in-pad
- Drilling Technology: Laser drilling and sequential lamination
- Materials: High-frequency laminates, low-loss dielectrics, halogen-free options
- Impedance Control: Tight tolerance impedance matching for high-speed designs
- Surface Finishes: ENEPIG, ENIG, immersion silver, gold plating
- Design Tolerances: Highly precise registration and alignment for fine-pitch ICs
Advantages:
- Maximum Routing Density: Ideal for small form factor devices with high pin-count ICs
- Excellent Signal Integrity: Controlled impedance and low-crosstalk routing
- Reduced Layer Count: More efficient use of space due to advanced interconnects
- Lightweight & Compact: Enables sleek, portable, and miniaturized device designs
- High Reliability: Superior thermal and mechanical performance under demanding conditions
Typical Applications:
- 5G base stations and mobile devices
- Aerospace avionics and satellite systems
- High-end medical diagnostic equipment
- AI and HPC modules, including GPUs and neural processing units
- Premium smartphones, tablets, and wearable technology